Technology Exchange & Showcase (2003)

Carried out by students at Tsinghua University in Beijing and Stanford University in Silicon Valley, TECC held the Technology Exchange & Showcase Program to foster student exchange and communication. Working with Stanford Student IEEE and Tsinghua University’s authority, TECC introduced Stanford students’ state-of-art research products to the 22nd Tsinghua Challenging Cup Invention Exhibition, the largest technology showcase that annually exhibits the most prominent student technological inventions in Tsinghua University. Stanford students had the opportunity to present the latest technological researches in areas of informational technology, mechanical engineering, biology and medical science by using videos, posters, pictures and text introductions across the Pacific. This showcase was also an important opportunity for TECC members in the two countries to establish mutual understandings and foster integrated cooperation in the upcoming programs.

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